公开(公告)号：US20230004324A1

公开(公告)日：2023-01-05

申请号：US17575907

申请日：2022-01-14

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jaehwan LIM ,  Jae Eun KIM ,  Ji-Hoon KIM ,  Walter JUN ,  Jungwoo LEE ,  Seung-Woo LIM

IPC: G06F3/06 ,  G06F9/48

Abstract: A storage device includes a nonvolatile memory device and a storage controller. The storage controller accesses the nonvolatile memory device based on a request of an external host device. The storage controller sends a signal to the external host device, based a throughput of accessing the nonvolatile memory device being within a specific range.

公开(公告)号：US20240086078A1

公开(公告)日：2024-03-14

申请号：US18197456

申请日：2023-05-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jaehwan LIM ,  Yeongyu Ahn ,  Hyunjung Yoo ,  Jungwoo Lee

IPC: G06F3/06

CPC classification number: G06F3/0619 ,  G06F3/0629 ,  G06F3/0653 ,  G06F3/0679

Abstract: A storage device includes at least one nonvolatile memory device and a storage controller. The storage controller controls the at least one nonvolatile memory device based on a request from an external host. The storage controller adaptively adjusts an impedance of a transmission driver based on a change of an operating temperature of the storage device. The transmission driver transmits a transmission signal to the external host through a link. The storage device may increase an eye height of the transmission signal transmitted to the host through the link by decreasing impedance of the transmission driver as the operating temperature increases. Therefore, the storage device according to example embodiments may maintain reliability of the link even though the operating temperature of the storage device increases.

公开(公告)号：US20220012141A1

公开(公告)日：2022-01-13

申请号：US17208312

申请日：2021-03-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sung-Wook KIM ,  So-Geum KIM ,  Daehun YOU ,  Jaehwan LIM

IPC: G06F11/20 ,  G06F1/28

Abstract: An electronic device includes: a power supply to supply a first power and a second power; a first solid state drive (SSD) backplane and a second SSD backplane to receive the first power from the power supply, each of the first solid state drive (SSD) backplane and the second SSD backplane including two or more SSDs; and a baseboard to receive the second power from the power supply, to independently power on and power off the first SSD backplane and the second SSD backplane, and to access the SSDs of an SSD backplane that is in a power-on state from among the first SSD backplane and the second SSD backplane. In response to an increase in temperature of an SSD backplane that is in a power-off state, at least one SSD of the SSD backplane that is in the power-off state may be powered on.