公开(公告)号：US20190323893A1

公开(公告)日：2019-10-24

申请号：US16157682

申请日：2018-10-11

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： SE JIN OH ,  TAE KYUN KANG ,  YU SIN KIM ,  JAE IK KIM ,  CHAN BIN MO ,  DOUG YONG SUNG ,  SEUNG BIN AHN ,  KUL INN ,  YUN KWANG JEON

IPC: G01J5/00 ,  H01L21/67 ,  G01B11/06 ,  H01J37/32

Abstract: A semiconductor substrate measuring apparatus includes a light source unit generating irradiation light including light in a first wavelength band and light in a second wavelength band. An optical unit irradiates the irradiation light on a measurement object and condenses reflected light. A light splitting unit splits the reflected light, condensed in the optical unit, into a first optical path and a second optical path. A first detecting unit is disposed on the first optical path and detects first interference light in the first wavelength band in the reflected light. A second detecting unit is disposed on the second optical path and detects second interference light in the second wavelength band in the reflected light. A controlling unit calculates at least one of a surface shape or a thickness of the measurement object. The controlling unit calculates a temperature of the measurement object.