公开(公告)号：US20230043451A1

公开(公告)日：2023-02-09

申请号：US17737490

申请日：2022-05-05

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yongmyung JUN ,  Hyunjin KO ,  Seohyun KIM ,  Jae Seong RYU ,  Inkwang BAE ,  Seungbu BAEK

IPC: H01L21/687 ,  H01L21/67

Abstract: A substrate processing chamber includes a housing providing a process space; a spin apparatus provided in the housing; and a fluid spraying nozzle configured to spray fluid into the process space, wherein the spin apparatus includes: a spin chuck configured to support a substrate; a rotation driving part configured to rotate the spin chuck; and a weight sensor configured to measure a weight of the substrate supported on the spin chuck.