公开(公告)号：US10930525B2

公开(公告)日：2021-02-23

申请号：US16665745

申请日：2019-10-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yieok Kwon ,  Ikjun Choi

IPC: H01L21/56 ,  H01L21/48 ,  H01L21/683 ,  H01L23/498

Abstract: A carrier substrate includes a core layer and at least one unit pattern portion, and the unit pattern portion includes a first metal layer disposed on the core layer, a release layer disposed on the first metal layer, a second metal layer disposed on the release layer, and a third metal layer disposed on the second metal layer and covering side surfaces of the release layer, and a method of manufacturing a semiconductor package using the carrier substrate.