公开(公告)号：US20240429110A1

公开(公告)日：2024-12-26

申请号：US18667838

申请日：2024-05-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jangwoo LEE ,  Hyunglak MA ,  Jiyong PARK ,  Jongbo SHIM

IPC: H01L23/16 ,  H01L23/31 ,  H01L23/498 ,  H01L25/065 ,  H01L25/10

Abstract: A semiconductor package includes a lower package having opposite first and second lower package sides that extend in a first direction; an upper package stacked on the lower package by conductive connection members, the upper package having opposite first and second upper package sides that extend in the first direction, wherein the second upper package side is spaced apart from the second lower package side by a predetermined distance to define an underfill region on an upper surface of the lower package; and an underfill member extending from the underfill region on the upper surface of the lower package to fill a space between the lower package and the upper package.