公开(公告)号：US10453462B2

公开(公告)日：2019-10-22

申请号：US15996939

申请日：2018-06-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Young-woo Lee ,  Sun-min Kim ,  Hwan Shim ,  Nam-suk Lee ,  Hyun-Wook Kim ,  Jong-hoon Jeong

IPC: H04R5/00 ,  G10L19/008

Abstract: A method of encoding a multi-channel 3-dimensional (3D) audio signal mixed with a multi-channel 3D object signal is provided. The method includes: obtaining a location parameter indicating a virtual location of the multi-channel 3D object signal on a multi-channel speaker layout based on a gain value of the multi-channel 3D object signal for each channel; and encoding the multi-channel 3D audio signal and the location parameter.