公开(公告)号：US20240153834A1

公开(公告)日：2024-05-09

申请号：US18483312

申请日：2023-10-09

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jun Ho LEE ,  Hyo Eun KIM

IPC: H01L23/18 ,  H01L23/00 ,  H01L23/31 ,  H01L23/367 ,  H01L23/48 ,  H01L25/065

CPC classification number: H01L23/18 ,  H01L23/3171 ,  H01L23/367 ,  H01L23/481 ,  H01L24/14 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204

Abstract: A semiconductor package is provided. The semiconductor package comprises a first semiconductor chip including a first semiconductor substrate, a through-via in the first semiconductor substrate, a second semiconductor chip on the first semiconductor chip, a filler structure extending from a top surface of the first semiconductor chip into the first semiconductor chip, and a heat spreader including a column portion spaced apart from the second semiconductor chip and disposed on the filler structure and a roof portion disposed on the second semiconductor chip and connected to the column portion.