公开(公告)号：US20210183686A1

公开(公告)日：2021-06-17

申请号：US16912875

申请日：2020-06-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seung-Nam KIM ,  Sung-Keun Cho ,  Seong Eon Park ,  Jung-Sub Shin ,  Joon-Sung Lee ,  Hyun Ik Joe ,  Hyeon Cheol Jin

IPC: H01L21/687

Abstract: A lift pin module includes a lift pin which includes a head portion disposed at a first end of the lift pin, and a connecting portion disposed at a second end of the lift pin opposite to the first end, the head portion connected to a stage disposed inside a semiconductor process chamber, and the head portion extending in a first direction; an upper weight which includes a side surface with an opening extending in the first direction, the opening configured to receive the lift pin therein, and the upper weight surrounding the connecting portion of the lift pin; and a lower weight screwed to the upper weight, the lower weight disposed below the upper weight.

公开(公告)号：US11282738B2

公开(公告)日：2022-03-22

申请号：US16912875

申请日：2020-06-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seung-Nam Kim ,  Sung-Keun Cho ,  Seong Eon Park ,  Jung-Sub Shin ,  Joon-Sung Lee ,  Hyun Ik Joe ,  Hyeon Cheol Jin

IPC: H01L21/687

Abstract: A lift pin module includes a lift pin which includes a head portion disposed at a first end of the lift pin, and a connecting portion disposed at a second end of the lift pin opposite to the first end, the head portion connected to a stage disposed inside a semiconductor process chamber, and the head portion extending in a first direction; an upper weight which includes a side surface with an opening extending in the first direction, the opening configured to receive the lift pin therein, and the upper weight surrounding the connecting portion of the lift pin; and a lower weight screwed to the upper weight, the lower weight disposed below the upper weight.