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公开(公告)号：US11577364B2
公开(公告)日：2023-02-14
申请号：US16225089
申请日：2018-12-19
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Yong-Hee Lee , Seung-Chul Han , Hui-Gwan Lee , Jong-Hwi Seo
IPC: B24B53/02 , B24B53/017 , B24B53/00
Abstract: A conditioner of a chemical mechanical polishing (CMP) apparatus includes a conditioning part to polish a polishing pad, an arm to rotate the conditioning part, and a flexible connector connecting the conditioning part with the arm, the flexible connector being moveable to allow relative movements of the conditioning part with respect to the arm.
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