公开(公告)号：US20230378206A1

公开(公告)日：2023-11-23

申请号：US18124973

申请日：2023-03-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ji Su PARK ,  Seung Joo NAH ,  Hoe Min JEONG ,  Hee Geun JEONG

IPC: H01L27/146

CPC classification number: H01L27/14623 ,  H01L27/1462 ,  H01L27/14645

Abstract: Disclosed is an image sensor including a substrate having a photoelectric conversion element disposed therein a passivation layer disposed on the substrate and extending in a first direction, a conductive pattern disposed on the passivation layer, and an adhesive layer deposited on the passivation layer and the conductive pattern, wherein the conductive pattern includes a first flat area disposed on the passivation layer and extending in the first direction, and an inclined area connected to the first flat area, wherein a first top face of the inclined area is bent from a second top face of the first flat area, wherein the first top face has a constant slope with respect to the second top face.