公开(公告)号：US12224260B2

公开(公告)日：2025-02-11

申请号：US17542667

申请日：2021-12-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Heejung Choi ,  Heeseok Lee ,  Junso Pak ,  Bongwee Yu

IPC: H01L23/00 ,  H01L23/498 ,  H01L25/10

Abstract: A semiconductor package including: a plurality of lower pads; an upper pad; a semiconductor chip including a chip pad and configured to transmit or receive a first signal through the chip pad; a first wiring structure connecting the chip pad to a first lower pad among the plurality of lower pads; and a second wiring structure connecting a second lower pad among the plurality of lower pads to the upper pad, wherein the first lower pad and the second lower pad are separated from each other by a minimum distance between the plurality of lower pads.

公开(公告)号：US11854985B2

公开(公告)日：2023-12-26

申请号：US17307037

申请日：2021-05-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Heejung Choi ,  Heeseok Lee ,  Junghwa Kim

IPC: H01L23/538 ,  H01L25/065 ,  H01L23/498 ,  H01L21/48 ,  H01L23/00 ,  H01L25/00

CPC classification number: H01L23/5383 ,  H01L21/486 ,  H01L23/49833 ,  H01L24/19 ,  H01L24/24 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/24146

Abstract: A semiconductor package includes: a first package including a first semiconductor chip; a second package under the first package, the second package including a second semiconductor chip; and a first interposer package between the first package and the second package, the first interposer package including: a power management integrated circuit (PMIC) configured to supply power to the first package and the second package; a core member having a through-hole in which the PMIC is disposed; a first redistribution layer on the core member, and electrically connected to the first package; a second redistribution layer under the core member, and electrically connected to the second package; core vias penetrating the core member, and electrically connecting the first redistribution layer with the second redistribution layer; and a first signal path electrically connecting the first package with the second package.