公开(公告)号：US20150236224A1

公开(公告)日：2015-08-20

申请号：US14607864

申请日：2015-01-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Chang-Hoon KWAK ,  Hak-Hwan KIM ,  Byung-Kwon YOON ,  Hyo-Jin LEE ,  Han-Na HEO

IPC: H01L33/50 ,  F21V8/00 ,  H01L33/62

CPC classification number: H01L33/504 ,  G02B6/0023 ,  G02B6/0073 ,  G02B6/009 ,  H01L25/167 ,  H01L33/486 ,  H01L33/505 ,  H01L33/62 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: Provided are a light emitting device package and a method of fabricating the same. The package includes a package body including a lead frame, a light emitting device mounted on the package body, a bonding wire configured to electrically connect an electrode formed on a top surface of the light emitting device with the lead frame, a phosphor sheet attached on the light emitting device, and a phosphor molding portion to cover the light emitting device and the phosphor sheet.

Abstract translation: 提供一种发光器件封装及其制造方法。 该封装包括一个封装主体，它包括一个引线框架，一个安装在封装主体上的发光器件，一个接合线，它被配置成将形成在发光器件顶表面上的电极与引线框架电连接， 发光装置和用于覆盖发光装置和荧光体片的荧光体成型部。