公开(公告)号：US20250087607A1

公开(公告)日：2025-03-13

申请号：US18773068

申请日：2024-07-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： HYEONMIN LEE ,  Haseob Seong ,  MINSEUNG JI

IPC: H01L23/00 ,  H01L23/48 ,  H01L23/528 ,  H01L25/065

Abstract: A semiconductor package includes a first semiconductor chip, a dummy die on the first semiconductor chip, second semiconductor chips stacked on the dummy die, and a dummy plate on the second semiconductor chips. Each of the first semiconductor chip, the dummy die, and the second semiconductor chips includes through-electrodes. The dummy die and the second semiconductor chip closest to the dummy die are connected to each other by direct contact of bonding pads. Adjacent ones of the second semiconductor chips are connected to each other by direct contact of bonding pads. The first semiconductor chip, the dummy die, the second semiconductor chip, and the dummy plate have a first width, a second width, a third width, and a fourth width in a horizontal direction, respectively. The fourth width is greater than the second width and the third width.