公开(公告)号：US20240355770A1

公开(公告)日：2024-10-24

申请号：US18638939

申请日：2024-04-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： YOUNG-DEUK KIM ,  MI-NA CHOI ,  HEEJUNG HWANG

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/48

CPC classification number: H01L24/16 ,  H01L23/3107 ,  H01L23/481 ,  H01L24/05 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/0401 ,  H01L2224/16145 ,  H01L2224/32145 ,  H01L2224/73204

Abstract: A semiconductor package includes a first semiconductor chip. A second semiconductor chip is disposed on the first semiconductor chip. A bump structure is disposed between the first semiconductor chip and the second semiconductor chip. The bump structure electrically connects the first semiconductor chip and the second semiconductor chip to each other. The bump structure includes a first bump pad and a second bump pad disposed on a same plane as each other, and a solder bump disposed between the first bump pad and the second bump pad. The solder bump abuts on a side of the first bump pad and a side of the second bump pad.

公开(公告)号：US20200335480A1

公开(公告)日：2020-10-22

申请号：US16724592

申请日：2019-12-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： HEEJUNG HWANG ,  JAE CHOON KIM ,  YUN SEOK CHOI

IPC: H01L25/065 ,  H01L23/367

Abstract: A semiconductor package includes: a first thermal pillar disposed on a package substrate, and having an opening; a first chip stack disposed on the package substrate and in the opening of the first thermal pillar, and including a first lateral surface; a semiconductor chip disposed on the package substrate and in the opening, wherein the semiconductor chip is spaced apart from the first chip stack; and a first heat transfer film disposed between the first thermal pillar and the first lateral surface of the first chip stack.