公开(公告)号：US20250087624A1

公开(公告)日：2025-03-13

申请号：US18611241

申请日：2024-03-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jing Cheng LIN ,  Sungjin Han ,  Gyeongjae JO ,  Hyunchul JUNG ,  Youngkun JEE

IPC: H01L23/00

Abstract: A semiconductor package manufacturing apparatus is provided and includes a bonding head including at least one vacuum hole, and at least one adsorption trench in a lower surface of the bonding head and connected to the at least one vacuum hole. A lower part of the bonding head includes at least one first portion, and a second portion spaced apart from the at least one first portion and surrounding the at least one first portion in a plan view. The at least one adsorption trench is defined by and between the at least one first portion and the second portion, and at least a portion of an inner surface of the at least one adsorption trench and at least a portion of an outer surface of the at least one adsorption trench are curved in the plan view.

公开(公告)号：US20240395764A1

公开(公告)日：2024-11-28

申请号：US18624233

申请日：2024-04-02

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Gyeongjae JO ,  Sangcheon PARK ,  Youngkun JEE

IPC: H01L23/00

Abstract: A bonding apparatus for a semiconductor device including: a substrate state having a seating surface on which a first semiconductor device is placed; a head portion having a lower surface, the head portion configured to hold a second semiconductor device on the lower surface to face the first semiconductor device, the lower surface including a first portion having a first height from the seating surface and a second portion having a second height from the seating surface, the second height being greater than the first height, the lower surface being inclined at an angle with respect to the seating surface; and a transfer portion provided on the head portion to move the head portion, the transfer portion configured to press the head portion from the first portion to the second portion such that the first and second semiconductor devices are bonded to each other.