公开(公告)号：US20230067767A1

公开(公告)日：2023-03-02

申请号：US17707002

申请日：2022-03-29

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： WOONCHUN KIM ,  SEUNGWAN SHIN ,  GUN LEE

IPC: H01L23/538 ,  H01L25/10 ,  H01L23/522 ,  H01L23/528 ,  H01L23/48 ,  H01L23/532 ,  H01L21/48 ,  H01L21/768 ,  H01L23/31 ,  H01L23/498

Abstract: A semiconductor package includes; a first redistribution structure including first redistribution conductors, a semiconductor chip on the first redistribution structure and including connection pads electrically connecting the first redistribution conductors, a connection conductor on the first redistribution structure, laterally spaced apart from the semiconductor chip, and electrically connected to the first redistribution conductors, an encapsulant on the first redistribution structure and sealing the semiconductor chip and at least a portion of the connection conductor, a barrier layer extending along an upper surface of the encapsulant, and a second redistribution conductor on the barrier layer and penetrating the barrier layer to contact the connection conductor.

公开(公告)号：US20230045383A1

公开(公告)日：2023-02-09

申请号：US17745612

申请日：2022-05-16

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： EUNSIL KIM ,  SEUNGHAN SIM ,  GUN LEE

IPC: H01L23/00

Abstract: A method of manufacturing a semiconductor package includes forming an insulating layer; forming a seed layer on the insulating layer; forming a photoresist layer on the seed layer; forming a plurality of line pattern holes by patterning the photoresist layer, a horizontal length of a middle portion of each of the plurality of line pattern holes being less than a horizontal length of an upper portion of each of the plurality of line pattern holes and a horizontal length of a lower portion of each of the plurality of line pattern holes; and forming a redistribution line pattern by performing a plating process using a portion of the seed layer exposed by the plurality of line pattern holes.