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公开(公告)号：US10428242B2
公开(公告)日：2019-10-01
申请号：US15897261
申请日：2018-02-15
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Doo-sik Moon , Sang-hyun Park , Bo-un Yoon , Ho-young Kim , Se-jung Park , Jae-hak Lee , Jin-myung Hwang
Abstract: A slurry composition for chemical mechanical polishing, the slurry composition including ceramic polishing particles; a dispersion agent; a pH control agent and an additive having affinity with silicon nitride.
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