公开(公告)号：US20180374709A1

公开(公告)日：2018-12-27

申请号：US15870227

申请日：2018-01-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Gon-jun KIM ,  Yuri BARSUKOV ,  Vladimir VOLYNETS ,  Dali LIU ,  Sang-jin AN ,  Beom-jin YOO ,  Sang-heon LEE ,  Shamik PATEL

IPC: H01L21/3065 ,  H01L21/02 ,  H01J37/32

CPC classification number: H01L21/3065 ,  H01J37/32009 ,  H01L21/02164 ,  H01L21/02315 ,  H01L21/31116

Abstract: An etching method using a remote plasma source (RPS) and a method of fabricating a semiconductor device, the etching method including generating a plasma by supplying a process gas to at least one RPS and applying power to the at least one RPS; and etching a first material film including SiNx by supplying the plasma and at least one control gas selected from HBr, HCl, HI, NH3, SiH4, CHF3, and CH2F2 to a process chamber.

公开(公告)号：US20170018451A1

公开(公告)日：2017-01-19

申请号：US15071228

申请日：2016-03-16

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Xinglong CHEN ,  Dali LIU ,  Sung-Ho JANG ,  Yong-Ho LIM

IPC: H01L21/687

CPC classification number: H01L21/68728

Abstract: A wafer clamping apparatus, including a plurality of support pins under a wafer, the plurality of pins to support the wafer; and a side clamp at a lateral side of the wafer, the side clamp to directly contact a lateral side of the wafer to press the wafer, the side clamp to press the wafer in a first direction or a second direction, the first direction and the second direction being different directions.

Abstract translation: 一种晶片夹持装置，包括晶片下面的多个支撑销，所述多个销支撑晶片; 以及在所述晶片的横向侧的侧夹具，所述侧夹具直接接触所述晶片的侧面以按压所述晶片，所述侧夹具将所述晶片沿第一方向或第二方向按第一方向和所述第二方向 第二个方向是不同的方向。