公开(公告)号：US20160118362A1

公开(公告)日：2016-04-28

申请号：US14852825

申请日：2015-09-14

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： ILYOUNG HAN ,  KYOUNGRAN KIM ,  DONGGIL SHIM ,  GEUNSIK OH ,  YOUNGJOO LEE ,  JUNHO LEE ,  SUKWON LEE

IPC: H01L23/00

CPC classification number: H01L24/75 ,  B23K3/087 ,  B23K37/04 ,  H01L2224/75252 ,  H01L2224/75704 ,  H01L2224/75705 ,  H01L2224/7598

Abstract: A bonding apparatus of substrate manufacturing equipment includes an upper stage, a lower stage facing the upper stage and which is configure and dedicated to support a processed substrate on which semiconductor chips are stacked (set), and an elevating mechanism for raising the lower stage relative to the upper stage to provide pressure for pressing the substrate and chips towards each other.

Abstract translation: 基板制造装置的接合装置包括上层，与上层相对的下层，其构造为专用于支撑半导体芯片堆叠的被处理基板（设置），以及用于升高下层相对的升降机构 以提供将基板和芯片彼此挤压的压力。