公开(公告)号：US20240255274A1

公开(公告)日：2024-08-01

申请号：US18425830

申请日：2024-01-29

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Changi Jeon ,  Younghoon Sohn

IPC: G01B11/06 ,  G01B11/24 ,  G01B15/04

CPC classification number: G01B11/06 ,  G01B11/24 ,  G01B15/04

Abstract: Provided is a complex sensing device including a thickness sensing device including pulse generating device configured to generate a probe pulse and a pump pulse, a first optical splitter configured to split the probe pulse and direct the pump pulse to a surface of a sample and generate an acoustic signal in the sample, a detector configured to receive a reflection probe pulse generated by the probe pulse being reflected from the sample, a first processor configured to receive and process a first signal from the detector, and a second optical splitter on a path of the reflection probe pulse from the sample to the detector, the second optical splitter being configured to split the reflection probe pulse, and a surface shape sensing device configured to receive a split probe pulse split from the first optical splitter and a split reflection probe pulse split from the second optical splitter, and measure a surface shape of the sample based on a phase difference between the split probe pulse and the split reflection probe pulse.