公开(公告)号：US20240098170A1

公开(公告)日：2024-03-21

申请号：US18518163

申请日：2023-11-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yonghee YANG ,  Changhee Park ,  Doil Ku

IPC: H04M1/02

CPC classification number: H04M1/0277 ,  H05K5/0086

Abstract: An electronic device includes: a frame including a coupling surface; a circuit board assembly coupled to the coupling surface of the frame, the circuit board assembly including a circuit board and a fixing hole provided in a surface of the circuit board and penetrating the circuit board in a thickness direction; a connecting member electrically connected to the circuit board assembly; and a circuit board fixing member provided on the coupling surface of the frame and passing through the fixing hole in the circuit board to fix the circuit board assembly to the frame, wherein the circuit board fixing member includes: a snap-fitting portion configured to be elastically deformed when passing through the fixing hole to couple the circuit board assembly to the coupling surface, and configured to prevent the circuit board assembly coupled to the coupling surface from moving; a guide groove in which the connecting member is accommodated; and a body portion fixed on the coupling surface and configured to support the snap-fitting portion and the guide groove.