公开(公告)号：US20180260202A1

公开(公告)日：2018-09-13

申请号：US15760457

申请日：2016-05-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Arnold YAU ,  Chan-kyu HAN ,  Sada SUNKESULA

IPC: G06F8/61 ,  H04L29/08

CPC classification number: G06F8/61 ,  G06F1/16 ,  G06F9/445 ,  G06F21/51 ,  G06F21/53 ,  G06F21/57 ,  H04L67/10 ,  H04L67/34

Abstract: Provided is a method of installing an application in an electronic device, the method including obtaining an application package for installing the application, determining whether the application package includes a trusted application (TA) that is installable in the electronic device, and installing the TA in the electronic device when the application package includes the TA.