公开(公告)号：US10784130B2

公开(公告)日：2020-09-22

申请号：US15838713

申请日：2017-12-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Joong-Ha Lee ,  Sang-Yoon Kim ,  YoungBum Kim ,  Hui-Jae Kim ,  SeungDae Seok ,  Jaebong Shin ,  Byungjoon Lee ,  Yongin Lee ,  Jaeyeon Pyo

IPC: H01L21/67 ,  H01L21/68 ,  H01L27/148 ,  H01L21/683

Abstract: A bonding apparatus includes a stage supporting a substrate, a first bonding head at a first side of the stage, the first bonding head to pick up a first chip and to bond the picked-up first chip onto the substrate, a second bonding head at a second side of the stage, the second bonding head to pick up a second chip and to bond the picked-up second chip onto the substrate, and a first image acquisition unit over a movement path of the stage to acquire an image of the stage.