公开(公告)号：US12300649B2

公开(公告)日：2025-05-13

申请号：US17702259

申请日：2022-03-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yong Ho Kim ,  Bo In Noh ,  Jeong Hoon Ahn

IPC: H01L23/00 ,  H01L25/065 ,  H01L25/10

Abstract: A semiconductor package is provided. The semiconductor package includes: a first stack including a first semiconductor substrate; a through via that penetrates the first semiconductor substrate in a first direction; a second stack that includes a second face facing a first face of the first stack, on the first stack; a first pad that is in contact with the through via, on the first face of the first stack; a second pad including a concave inner side face that defines an insertion recess, the second pad located on the second face of the second stack; and a bump that connects the first pad and the second pad, wherein the bump includes a first upper bump on the first pad, and a first lower bump between the first upper bump and the first pad.