公开(公告)号：US20240106125A1

公开(公告)日：2024-03-28

申请号：US18514723

申请日：2023-11-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Soonheung KWON ,  Hosaeng KIM ,  Ahyun SHIN ,  Sumin YUN ,  Hyungjoo LEE

IPC: H01Q9/04 ,  H01Q1/24 ,  H01Q1/48 ,  H01Q5/10

CPC classification number: H01Q9/0407 ,  H01Q1/243 ,  H01Q1/48 ,  H01Q5/10

Abstract: An electronic device includes a substrate including a ground layer; and a plurality of antenna structures space apart from each other on the substrate. Each of the plurality of antenna structures may include, on the substrate: a rectangular first conductive patch including a pair of cutting portions in which diagonally opposite corners are cut; a rectangular second conductive patch disposed so as to be coupled to the first conductive patch; and a plurality of conductive pads which are disposed along the periphery of the second conductive patch so as to be spaced apart from each other at a specified interval, and are electrically connected to the ground layer.