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公开(公告)号：US09801281B2
公开(公告)日：2017-10-24
申请号：US14686298
申请日：2015-04-14
发明人： Jea-Hoon Lee , Woo-Jin Choi , Young-Key Kim
CPC分类号： H05K1/181 , H01C1/012 , H01C1/028 , H01C1/14 , H01C17/006 , H01C17/281 , H05K1/111 , H05K3/30 , H05K2201/10022 , Y10T29/49103
摘要： A resistance assembly for a mobile device and a manufacturing method thereof are disclosed. The resistance assembly for a mobile device in accordance with an aspect of the present invention includes: a substrate having a circuit formed thereon; first to fourth pads laminated and separated from one another on the substrate; first to fourth terminals connected to the first to fourth pads, respectively, by being formed in a longitudinal direction along edges of lateral surfaces of a resistance body that are opposite to each other; and first and second resistors formed in between the first to fourth terminals along the opposite lateral and connected in parallel to each other on the resistance body and configured to adjust electric current flowed into the circuit.
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公开(公告)号：US09761355B2
公开(公告)日：2017-09-12
申请号：US14696246
申请日：2015-04-24
发明人： Jea-Hoon Lee , Woo-Jin Choi , Young-Key Kim
CPC分类号： H01C1/01 , H01C1/14 , H01C7/003 , H01C13/02 , H01C17/006
摘要： A resistance assembly for a mobile device and a manufacturing method thereof are disclosed. The resistance assembly for a mobile device in accordance with an embodiment of the present invention includes: a substrate having a circuit formed thereon; first to third pads laminated and separated from one another on the substrate; first to third terminals connected to the first to third pads, respectively; and first and second resistors formed between the first and second terminals and between the second and third terminals, respectively, and serially connected to each other and configured to adjust electric current flowed into the circuit.
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