公开(公告)号：US09406630B2

公开(公告)日：2016-08-02

申请号：US14579542

申请日：2014-12-22

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Joo-Han Kim ,  Ki-Yong Song ,  Dong-Ju Yang ,  Hee-Joon Kim ,  Yeo-Geon Yoon ,  Sung-Hen Cho ,  Chang-Hoon Kim ,  Jae-Hong Kim ,  Yu-Gwang Jeong ,  Ki-Yeup Lee ,  Sang-Gab Kim ,  Yun-Jong Yeo ,  Shin-Il Choi ,  Ji-Young Park

IPC: H01L23/00 ,  G02F1/1362 ,  H01L27/12

CPC classification number: H01L24/05 ,  G02F1/136227 ,  H01L27/12 ,  H01L27/1214 ,  H01L27/124 ,  H01L2224/04042 ,  H01L2924/14 ,  H01L2924/1426 ,  H01L2924/00

Abstract: A contact portion of wiring and a method of manufacturing the same are disclosed. A contact portion of wiring according to an embodiment includes: a substrate; a conductive layer disposed on the substrate; an interlayer insulating layer disposed on the conductive layer and having a contact hole; a metal layer disposed on the conductive layer and filling the contact hole; and a transparent electrode disposed on the interlayer insulating layer and connected to the metal layer, wherein the interlayer insulating layer includes a lower insulating layer and an upper insulating layer disposed on the lower insulating layer, the lower insulating layer is undercut at the contact hole, and the metal layer fills in the portion where the lower insulating layer is undercut.