公开(公告)号：US20180114952A1

公开(公告)日：2018-04-26

申请号：US15789611

申请日：2017-10-20

Applicant: Samsung Display Co., Ltd.

Inventor： Byeonghyun KIM ,  Myungsoo KYUNG ,  Seungjoo LEE

IPC: H01L51/56 ,  G06T7/70

CPC classification number: H01L51/56 ,  G06T7/70 ,  H01L51/0013

Abstract: An apparatus for manufacturing a display apparatus includes: a support; a first stage on the support and configured to be linearly movable and to receive a film member thereon; a second stage on the support and spaced from the first stage, the second stage being configured to be linearly movable and to receive a display panel thereon; and a drum spaced from the first stage and the second stage and configured to selectively receive the film member and to transfer the film member to the display panel. The first stage, the second stage, and the drum are arranged along a first direction.

公开(公告)号：US20170257953A1

公开(公告)日：2017-09-07

申请号：US15449697

申请日：2017-03-03

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Jun-hee LEE ,  Sang-hoon BACK ,  Daeho YANG ,  Seungjoo LEE ,  Myung-gil CHOI ,  Taeyoung PARK

IPC: H05K3/36 ,  H05K13/00

Abstract: Provided is a method for manufacturing an electronic device. The method includes providing a panel to a stage, providing a circuit board, aligning the circuit board so that first pads of the circuit board face a first pad area of the panel and second pads of the circuit board face a second pad area of the panel, and compressing a first portion of the circuit board on which the first pads are arranged to the first pad area of the panel. The aligning of the circuit board occurs via by external contact on one surface of the first portion of the circuit board and one surface of the second portion of the circuit board.