公开(公告)号：US20220208892A1

公开(公告)日：2022-06-30

申请号：US17468669

申请日：2021-09-08

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Seul Gi Han ,  Seok Soon Back

IPC: H01L27/32 ,  H01L51/00 ,  H01L51/56

Abstract: An embodiment of the present invention provides a manufacturing method of a display device, including: forming a pixel circuit portion overlapping a display area on a substrate; forming a first electrode that is electrically connected to the pixel circuit portion; forming a partition wall overlapping a portion of the first electrode; forming a dummy line overlapping a peripheral area surrounding the display area by using a dispenser; and forming at least a portion of an intermediate layer in the partition wall by an inkjet process.

公开(公告)号：US11980082B2

公开(公告)日：2024-05-07

申请号：US17468669

申请日：2021-09-08

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Seul Gi Han ,  Seok Soon Back

IPC: H01L27/32 ,  H01L51/00 ,  H01L51/56 ,  H10K59/122 ,  H10K59/88 ,  H10K71/00 ,  H10K71/13 ,  H10K71/40 ,  H10K59/12

CPC classification number: H10K59/88 ,  H10K59/122 ,  H10K71/00 ,  H10K71/135 ,  H10K71/40 ,  H10K59/1201

Abstract: An embodiment of the present invention provides a manufacturing method of a display device, including: forming a pixel circuit portion overlapping a display area on a substrate; forming a first electrode that is electrically connected to the pixel circuit portion; forming a partition wall overlapping a portion of the first electrode; forming a dummy line overlapping a peripheral area surrounding the display area by using a dispenser; and forming at least a portion of an intermediate layer in the partition wall by an inkjet process.