DEPOSITION APPARATUS
    1.
    发明公开

    公开(公告)号:US20240068084A1

    公开(公告)日:2024-02-29

    申请号:US18239101

    申请日:2023-08-28

    CPC classification number: C23C14/24 C23C14/042 H10K59/12

    Abstract: A deposition apparatus includes: a chamber; a deposition source disposed in the chamber to include nozzles arranged in a first direction; and a deposition angle limiter disposed on the deposition source in the chamber. The deposition angle limiter includes: a low-incident angle limiting plate disposed between adjacent first and second nozzles among the nozzles and spaced apart from the first nozzle by a first height in a height direction intersecting the first direction; and a high-incident angle limiting plate surrounding at least a portion of the first nozzle and spaced apart from the first nozzle by a second height in the height direction. The first nozzle extends in the height direction.

    APPARATUS AND METHOD FOR MANUFACTURING DISPLAY APPARATUS

    公开(公告)号:US20240322067A1

    公开(公告)日:2024-09-26

    申请号:US18387111

    申请日:2023-11-06

    CPC classification number: H01L33/005 H01L2933/0075

    Abstract: An apparatus for manufacturing a display apparatus includes: an evaporation source including a nozzle configured to spray a deposition material, a first frame arranged on the evaporation source and defining a trench therein, and a first angle limiting plate arranged in the trench of the first frame and defining a plurality of slits therein, where the trench extends in a lengthwise direction of the first frame.

    MASK FRAME AND DEPOSITION APPARATUS INCLUDING THE SAME

    公开(公告)号:US20230383395A1

    公开(公告)日:2023-11-30

    申请号:US18230714

    申请日:2023-08-07

    CPC classification number: C23C14/042 H10K71/166 B05C21/005

    Abstract: A mask frame includes a support substrate including a plurality of inner side surfaces. The plurality of inner side surfaces defines a first opening through the support substrate. A heat dissipation plate is disposed on the plurality of inner side surfaces. A plurality of fixing portions is disposed between the support substrate and the heat dissipation plate. The plurality of fixing portions includes a plurality of adhesive portions attaching the support substrate to the heat dissipation plate.

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