PARTICLE REMOVAL APPARATUS AND LASER CUTTING APPARATUS INCLUDING THE SAME

    公开(公告)号:US20190247954A1

    公开(公告)日:2019-08-15

    申请号:US16191575

    申请日:2018-11-15

    CPC classification number: B23K26/142 B23K26/1476 B23K2101/36

    Abstract: A particle removal device includes: a stage on which a target substrate is disposed; an inner case defining a first discharge opening through which the stage is exposed to an internal space of the inner case; an outer case including: a side wall portion surrounding the inner case, a protrusion portion protruded from the side wall portion toward the inner case, and a second discharge opening in fluid connection with the first discharge opening; a suction pump connected to the second discharge opening; an air injector in fluid connection with the internal space; and an intake opening in fluid connection with the first and second discharge openings. A width of the intake opening as a distance between the distal end of the inner case and the distal end of the protrusion portion is smaller than a width of the first discharge opening.

    STAGE FOR CUTTING SUBSTRATE AND SUBSTRATE CUTTING DEVICE

    公开(公告)号:US20190217427A1

    公开(公告)日:2019-07-18

    申请号:US16248505

    申请日:2019-01-15

    CPC classification number: B23K37/0408 B23K26/38 B23K2101/40 B25B11/005

    Abstract: A stage for cutting a substrate includes: a body member; a plurality of first discharging members, each including a first suction portion in the body member and a first partition wall portion connected to the first suction portion and protruding from a top surface of the body member, each of the first discharging members defining a first space connected to an outside; a plurality of second discharging members, each including a second suction portion in the body member and a second partition wall portion connected to the second suction portion and protruding from the top surface of the body member, each of the second discharging members defining a second space connected to the outside; a plurality of connecting pipes each connected to the first partition wall portion and the second partition wall portion; and a plurality of supply pipes connected to the connecting pipes.

    LASER APPARATUS INCLUDING FASTENING HOLES AND INLET GROOVES

    公开(公告)号:US20190217414A1

    公开(公告)日:2019-07-18

    申请号:US16249533

    申请日:2019-01-16

    CPC classification number: B23K26/142 B08B5/04

    Abstract: A laser apparatus including a stage. A target substrate is mounted on the stage. The laser apparatus further includes a coupling unit disposed below the stage and coupled with a conveying unit, the conveying unit conveying the stage. The laser apparatus additionally includes a discharge unit disposed at a predetermined position for laser machining, configured to communicate with the coupling unit when docked with the coupling unit, and configured to discharge foreign matter that is generated during laser machining.

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