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公开(公告)号：US11973310B2
公开(公告)日：2024-04-30
申请号：US16505964
申请日：2019-07-09
发明人： Takashi Honda , Kowang Liu , Kwun Pan Ng , Makoto Kawato
CPC分类号： H01S5/0216 , G11B5/314 , H01S5/0237 , H01S5/0261 , G11B2005/0021 , H01S5/02453
摘要： A light source unit for thermally-assisted magnetic head includes a substrate member having a first bonding surface; a light source assembly attached on the first bonding surface of the substrate member and having a second bonding surface; and a heater circuit assembly formed between the substrate member and the light source assembly, the heater circuit assembly having a heater formed on the substrate member and two leads connected at two ends of the heater, the lead being thicker than the heater, thereby a distance between the heater and the second bonding surface is farther than that between the lead and the second bonding surface. The light source unit can reduce mechanical stress and thermal conduction between a light source assembly and a substrate member, thereby improving the performance of the light source assembly and the heater.
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公开(公告)号：US10566013B1
公开(公告)日：2020-02-18
申请号：US16250131
申请日：2019-01-17
发明人： Takashi Honda , Ryo Hosoi , Wah Chun Chan , Makoto Kawato , Dayu Zhou , Koji Shimazawa , Kowang Liu
IPC分类号： G11B11/105 , G11B5/012 , G11B5/00 , G11B5/31 , G11B5/60
摘要： A light source unit for thermally-assisted magnetic head includes a substrate member having a bonding surface, multiple layers formed on the bonding surface and comprising a base layer, a connection pad layer, an insulation layer and a bonding layer; a light source assembly attached on the bonding layer of the substrate member and having a laser diode embedded therein and connected to the connection pad layer on the bonding surface, so as to form a laser diode circuit; and a heater buried in the insulation layer and connected to the connection pad layer, so as to form a heater circuit. The light source unit can maintain stable heat power for facilitating performance of the thermally-assisted magnetic head, and further reduce the sizes of the light source unit and substrate member.
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