公开(公告)号：US20220356065A1

公开(公告)日：2022-11-10

申请号：US17697735

申请日：2022-03-17

Applicant: Rohm and Haas Electronic Materials CMP Holdings, Inc.

Inventor： Changzai Chi ,  Murali Ganth Theivanayagam ,  Kwadwo Tettey

IPC: C01B33/142 ,  C09K3/14 ,  C01B33/146

Abstract: Modified silanized colloidal silica particles are reaction products of silanized colloidal silica particles having epoxy moieties with a nitrogen of an amino group of an amino acid to form stable modified silanized colloidal silica particles. The modified silanized colloidal silica particles can be used as an abrasive in chemical mechanical polishing of various substrates.

公开(公告)号：US20220348790A1

公开(公告)日：2022-11-03

申请号：US17697709

申请日：2022-03-17

Applicant: Rohm and Haas Electronic Materials CMP Holdings, Inc.

Inventor： Changzai Chi ,  Kwadwo Tettey ,  Matthew Richard Van Hanehem ,  Murali Ganth Theivanayagam ,  Li Zhang ,  David Wayne Mosley

IPC: C09G1/02 ,  C08K3/36 ,  C08K9/06

Abstract: Chemical mechanical polishing compositions include modified silanized colloidal silica particles which are reaction products of silanized colloidal silica particles having epoxy moieties with nitrogen of amines to form stable and tunable modified silanized colloidal silica particles. The modified silanized colloidal silica particles can be used as an abrasive in chemical mechanical polishing of various substrates to polish metal such as copper, Ta and TaN and dielectrics such as TEOS and low-K film.