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公开(公告)号：US20240080992A1
公开(公告)日：2024-03-07
申请号：US17929114
申请日：2022-09-01
申请人： Reophotonics, Ltd.
发明人： Michael Zenou , Stéphane Etienne
CPC分类号： H05K3/1291 , B41M5/0041 , C23C14/28 , C23C14/5806 , H05K2203/107 , H05K2203/1105
摘要： Methods for creating a conductive pillar on a receiver substrate may include forming a dried metal paste pillar by printing metal paste over an area of a receiver substrate, drying the metal paste, and repeating the printing and drying steps. The dried metal paste pillar may be inspected so as to determine a height of the dried metal paste pillar. If the height of the dried metal paste pillar is less than a desired height, additional metal paste may be printed onto to the dried metal paste pillar and dried. If the height of the dried metal paste pillar exceeds the desired height, a portion of the dried metal paste pillar may be ablated. The dried metal paste pillar may be sintered so as to form the conductive pillar. Conductive pillars that are produced according to the methods may be used as part of the formation of a flip-chip assembly.
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公开(公告)号：US12089343B2
公开(公告)日：2024-09-10
申请号：US17929114
申请日：2022-09-01
申请人： Reophotonics, Ltd.
发明人： Michael Zenou , Stéphane Etienne
CPC分类号： H05K3/1291 , B41M5/0041 , C23C14/28 , C23C14/5806 , H05K2203/107 , H05K2203/1105
摘要： Methods for creating a conductive pillar on a receiver substrate may include forming a dried metal paste pillar by printing metal paste over an area of a receiver substrate, drying the metal paste, and repeating the printing and drying steps. The dried metal paste pillar may be inspected so as to determine a height of the dried metal paste pillar. If the height of the dried metal paste pillar is less than a desired height, additional metal paste may be printed onto to the dried metal paste pillar and dried. If the height of the dried metal paste pillar exceeds the desired height, a portion of the dried metal paste pillar may be ablated. The dried metal paste pillar may be sintered so as to form the conductive pillar. Conductive pillars that are produced according to the methods may be used as part of the formation of a flip-chip assembly.
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