公开(公告)号：US20150015453A1

公开(公告)日：2015-01-15

申请号：US14505980

申请日：2014-10-03

Applicant: Raytheon Company

Inventor： Angelo M. Puzella ,  Donald A. Bozza ,  James R. Robbins ,  John B. Francis

IPC: H01Q21/00 ,  H05K1/02 ,  H01P1/38

CPC classification number: H01Q21/0025 ,  H01L2223/6677 ,  H01L2223/6683 ,  H01L2224/16227 ,  H01L2224/73253 ,  H01P1/38 ,  H01Q1/02 ,  H01Q9/0414 ,  H01Q21/00 ,  H01Q21/0087 ,  H01Q21/065 ,  H05K1/0206 ,  H05K1/0207

Abstract: A mixed-signal, multilayer printed wiring board fabricated in a single lamination step is described. The PWB includes one or more radio frequency (RF) interconnects between different circuit layers on different circuit boards which make up the PWB. The PWB includes a number of unit cells with radiating elements and an RF cage disposed around each unit cell to isolate the unit cell. A plurality of flip-chip circuits are disposed on an external surface of the PWB and a heat sink can be disposed over the flip chip components.

Abstract translation: 描述了在单个层压步骤中制造的混合信号多层印刷线路板。 PWB包括组成PWB的不同电路板上的不同电路层之间的一个或多个射频（RF）互连。 PWB包括具有辐射元件的多个单元电池和围绕每个单元电池设置的RF笼以隔离晶胞。 多个倒装芯片电路设置在PWB的外表面上，并且散热器可以设置在倒装芯片部件之上。