公开(公告)号：US4760948A

公开(公告)日：1988-08-02

申请号：US65611

申请日：1987-06-23

申请人： Ray G. Spiecker

发明人： Ray G. Spiecker

IPC分类号： H05K3/34 ,  H05K13/04

CPC分类号： H05K3/3442 ,  H05K13/0465 ,  H05K2201/09781 ,  H05K2201/10719 ,  H05K2201/10727 ,  H05K2201/10969 ,  H05K2201/2036 ,  H05K2203/306 ,  Y02P70/613

摘要： A leadless ceramic chip carrier (LCCC) is soldered to mating conductor pads on a circuit board by depositing a layer of solder paste on peripheral contact pads and on an array of central pads on the board. The same solder paste type and melt temperature are used for both peripheral and central pads. the contact pads of the LCCC are placed on the solder layers and the assembly exposed to infrared radiation from above or other energy source. The LCCC body shades the solder on the central pads resulting in the solder layers at the peripheral pads melting first. The solder on the central pads then melts and balls up due to surface tension lifting the LCCC away from the board stretching the melted solder at the peripheral pads which make the electrical connections to the LCCC contacts.

摘要翻译： 无引线陶瓷芯片载体（LCCC）通过在外围接触焊盘和板上的中心焊盘阵列上沉积一层焊膏而焊接到电路板上的匹配导体焊盘。 相同的焊膏类型和熔体温度用于外围和中心焊盘。 LCCC的接触垫放置在焊料层上，该组件暴露于来自上述或其他能量源的红外辐射。 LCCC主体将焊料遮蔽在中心焊盘上，导致外围焊盘上的焊料层首先熔化。 中心焊盘上的焊料然后由于表面张力而熔化和焊球，LCCC远离板延伸在外围焊盘处熔化的焊料，从而形成与LCCC触点的电连接。