公开(公告)号：US20150256230A1

公开(公告)日：2015-09-10

申请号：US14719378

申请日：2015-05-22

Applicant: RENESAS ELECTRONICS CORPORATION

Inventor： Koichi YAMAGUCHI

IPC: H04B5/00 ,  H04B1/034 ,  H04L25/08

CPC classification number: H04B5/0081 ,  H01L2224/32145 ,  H01L2224/48145 ,  H01L2224/73265 ,  H04B1/034 ,  H04B5/0031 ,  H04L25/0266 ,  H04L25/08 ,  H01L2924/00 ,  H01L2924/00012

Abstract: In a related transmitting circuit employing electromagnetic induction that is used in a communication system, there is a problem in that, because only one inductor is used in the transmitting circuit, it is impossible to perform communication at a data rate higher than the self-resonant frequency of the inductor. A transmitting circuit according to an embodiment of the present invention is a transmitting circuit that drives an inductor to transmit data to a semiconductor chip insulated from a semiconductor chip on which the transmitting circuit is mounted, and includes a driving circuit that receives outgoing data transmitted at a data rate higher than the self-resonant frequency of the inductor and outputs an outgoing signal that drives the inductor at the data rate of the outgoing data.

Abstract translation: 在通信系统中使用电磁感应的相关发送电路中，存在的问题在于，由于在发送电路中仅使用一个电感器，所以不可能以高于自谐振的数据速率进行通信 电感的频率。 根据本发明的实施例的发送电路是驱动电感器以将数据发送到与其上安装有发送电路的半导体芯片绝缘的半导体芯片的发送电路，并且包括驱动电路，其接收在 数据速率高于电感器的自谐振频率，并以输出数据的数据速率输出驱动电感器的输出信号。

公开(公告)号：US20130203361A1

公开(公告)日：2013-08-08

申请号：US13739065

申请日：2013-01-11

Applicant: RENESAS ELECTRONICS CORPORATION

Inventor： Kenichiro HIJIOKA ,  Koichi YAMAGUCHI

IPC: H04B1/40

CPC classification number: H04B1/40 ,  H01L23/495 ,  H01L23/49541 ,  H01L23/49575 ,  H01L24/73 ,  H01L2223/6677 ,  H01L2224/05553 ,  H01L2224/32245 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/73265 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2924/00

Abstract: Disclosed is a semiconductor device including a semiconductor chip and a semiconductor package. The semiconductor package includes an antenna formed of a lead frame, a first wire that connects the antenna and a first electrode pad of the semiconductor chip, and a second wire that connects the antenna and a second electrode pad of the semiconductor chip. The semiconductor chip is disposed in one of four regions in the semiconductor package sectioned by line segments connecting midpoints of two pairs of opposing sides of the semiconductor package. A centroid of the semiconductor chip is positioned outside a closed curve composed of a straight line segment connecting a first connection point where the antenna and the first wire are connected and a second connection point where the antenna and the second wire are connected, and a line connecting the first and second connection points along the antenna.

Abstract translation: 公开了包括半导体芯片和半导体封装的半导体器件。 半导体封装包括由引线框架形成的天线，连接天线的第一导线和半导体芯片的第一电极焊盘以及连接天线和半导体芯片的第二电极焊盘的第二导线。 半导体芯片设置在半导体封装中的四个区域中的一个区域中，该半导体封装通过连接半导体封装的两对相对侧的中点的线段分段。 半导体芯片的质心位于由连接天线和第一线连接的第一连接点的直线段和连接天线和第二线的第二连接点组成的闭合曲线之外，线 沿着天线连接第一和第二连接点。