公开(公告)号：US11958785B2

公开(公告)日：2024-04-16

申请号：US16680602

申请日：2019-11-12

Applicant: RAYTHEON COMPANY

Inventor： Stephanie Silberstein Bell ,  Thomas M. Hartnett ,  Richard Gentilman ,  Derrick J. Rockosi ,  Jeremy Wagner

IPC: C04B37/00 ,  C04B35/01 ,  C04B35/44 ,  C04B35/645 ,  C09K11/08 ,  C09K11/77 ,  G21K4/00

CPC classification number: C04B37/003 ,  C04B37/005 ,  C09K11/08 ,  C04B2235/764 ,  C04B2237/10 ,  C04B2237/34

Abstract: A method of bonding includes applying a glass composition to at least a first material surface. The glass composition includes a glass powder and a solvent. The first material surface is disposed onto a second material surface. An elevated temperature is applied to the first material surface and the second material surface to form a bond between the first material surface and the second material surface. The first material surface and the second material surface are compressed under an isostatic pressure.

公开(公告)号：US20210139383A1

公开(公告)日：2021-05-13

申请号：US16680602

申请日：2019-11-12

Applicant: RAYTHEON COMPANY

Inventor： Stephanie Silberstein Bell ,  Thomas M. Hartnett ,  Richard Gentilman ,  Derrick J. Rockosi ,  Jeremy Wagner

IPC: C04B37/00 ,  C09K11/08

Abstract: A method of bonding includes applying a glass composition to at least a first material surface. The glass composition includes a glass powder and a solvent. The first material surface is disposed onto a second material surface. An elevated temperature is applied to the first material surface and the second material surface to form a bond between the first material surface and the second material surface. The first material surface and the second material surface are compressed under an isostatic pressure.