公开(公告)号：US20170085096A1

公开(公告)日：2017-03-23

申请号：US14863009

申请日：2015-09-23

Applicant: QUALCOMM Incorporated

Inventor： John Hyunchul Hong ,  Bing Wen ,  Edward Keat Leem Chan ,  Tallis Young Chang ,  Zhigang Zhou ,  Yaoling Pan

IPC: H02J5/00 ,  H02J50/12 ,  H02J7/02

CPC classification number: H02J50/12

Abstract: This disclosure provides methods and apparatus for wireless power transfer using an array of structures. Each of the structures can include a piezoelectric material portion and a magnetic material portion. Each of the magnetic material portions can respond to an alternating magnetic field generated by an external transmitter device, resulting in the structures oscillating and straining the corresponding piezoelectric material portions to generate electrical current.