公开(公告)号：US11177553B2

公开(公告)日：2021-11-16

申请号：US16863874

申请日：2020-04-30

Applicant: QUALCOMM Incorporated

Inventor： Sang-June Park ,  Peter Han Lien ,  Eric Lunzer ,  Timothy Vu

IPC: H01Q1/24 ,  H01Q1/22 ,  H01Q23/00 ,  H04B1/40 ,  H01Q1/50

Abstract: Aspects described herein relate to at least a portion of a connector configured to support wireless communications that includes multiple chambers, each at least partially enclosed by a continuous isolation structure to provide electrical signal isolation and defining an inner surface. At least one terminal in a first chamber of the multiple chambers is configured for a first interface, and at least one terminal in a second chamber of the multiple chambers is configured for a second interface.