公开(公告)号：US20230262702A1

公开(公告)日：2023-08-17

申请号：US17673637

申请日：2022-02-16

Applicant: QUALCOMM Incorporated

Inventor： Gideon Shlomo Kutz ,  Tai Oved ,  Elad Meir ,  Moshe Ben-Ari ,  Shay Landis

IPC: H04W72/04 ,  H04W52/52

CPC classification number: H04W72/0406 ,  H04W72/0446 ,  H04W52/52

Abstract: Methods, systems, and devices for wireless communications are described. In some examples, when a high subcarrier spacing (SCS) is used for sidelink communications, the user equipments (UEs) may use a modified sidelink slot structure for the sidelink communications. In one example, the slot structure may include at least two automatic gain control (AGC) symbols with at least one sidelink control channel symbol between the two AGC symbols. The UE may perform an AGC procedure during the two AGC symbols and the sidelink control channel symbol. In some examples, the slot structure may include bundled slots to minimize per slot overhead associated with AGC symbols and sidelink control channel symbols. For example, at a high SCS, the slot structure may include a first slot including multiple AGC symbols, Subsequent bundled slots may not include AGC symbols and/or sidelink control channel symbols.