公开(公告)号：US20240170488A1

公开(公告)日：2024-05-23

申请号：US17993594

申请日：2022-11-23

Applicant: QUALCOMM Incorporated

Inventor： Renukprasad HIREMATH ,  Keyurkumar Karsanbhai KANSAGRA ,  Shashikumar GANESH BHAT ,  Hyeokjin LIM ,  Seung Hyuk KANG ,  Venugopal BOYNAPALLI ,  Kamesh MEDISETTI

IPC: H01L27/118 ,  H03K19/094

CPC classification number: H01L27/11807 ,  H03K19/094 ,  H01L2027/11866 ,  H01L2027/11875 ,  H01L2027/11881 ,  H01L2027/11885

Abstract: An integrated circuit (IC) cell including: a first logic gate comprising a first polysilicon structure and a first pin; a second logic gate comprising a second polysilicon structure and a second pin, wherein the second polysilicon structure is spaced apart and adjacent to the first polysilicon structure in a cell row direction; and a source region, common to the first and second logic gates, situated between the first and second polysilicon structures, wherein the first and second pins are on a first metal track directly over the common source region.