公开(公告)号：US20170222613A1

公开(公告)日：2017-08-03

申请号：US15422434

申请日：2017-02-01

Applicant: QUALCOMM Incorporated

Inventor： Alon YEHEZKELY ,  Sagi KUPFERMAN

IPC: H03H7/01 ,  H03F3/195 ,  H03F1/02 ,  H04B1/40

CPC classification number: H03H7/0115 ,  H01L23/50 ,  H01L23/5223 ,  H01L23/5227 ,  H03F1/0222 ,  H03F1/565 ,  H03F3/193 ,  H03F3/195 ,  H03F2200/294 ,  H03F2200/408 ,  H03F2200/451 ,  H04B1/40

Abstract: The disclosure generally relates to a compact bypass and decoupling structure that can be used in a millimeter-wave radio frequency integrated circuit (RFIC). For example, according to various aspects, an RFIC incorporating the compact bypass and decoupling structure may comprise a grounded substrate, a mid-metal ground plane, a bypass capacitor disposed between the grounded substrate and the mid-metal ground plane, and a decoupling inductor disposed over the mid-metal ground plane. The bypass capacitor may close a current loop in the RFIC and the decoupling inductor may provide damping in a supply network associated with the RFIC. Furthermore, the decoupling conductor may have a self-resonance substantially close to an operating band associated with the RFIC to increase series isolation, introduce substrate losses that facilitate the damping in the supply network, and prevent high-Q resonances.

公开(公告)号：US20190007017A1

公开(公告)日：2019-01-03

申请号：US16100185

申请日：2018-08-09

Applicant: QUALCOMM Incorporated

Inventor： Alon YEHEZKELY ,  Sagi KUPFERMAN

IPC: H03H7/01 ,  H03F3/193 ,  H03F1/56 ,  H01L23/522 ,  H01L23/50 ,  H03F1/02 ,  H03F3/195 ,  H04B1/40

CPC classification number: H03H7/0115 ,  C07K14/005 ,  C12N2760/16122 ,  C12N2760/16222 ,  H01L23/50 ,  H01L23/5223 ,  H01L23/5227 ,  H01L23/66 ,  H03F1/0222 ,  H03F1/565 ,  H03F3/193 ,  H03F3/195 ,  H03F2200/294 ,  H03F2200/408 ,  H03F2200/451 ,  H04B1/40

Abstract: The disclosure generally relates to a compact bypass and decoupling structure that can be used in a millimeter-wave radio frequency integrated circuit (RFIC). For example, according to various aspects, an RFIC incorporating the compact bypass and decoupling structure may comprise a grounded substrate, a mid-metal ground plane, a bypass capacitor disposed between the grounded substrate and the mid-metal ground plane, and a decoupling inductor disposed over the mid-metal ground plane. The bypass capacitor may close a current loop in the RFIC and the decoupling inductor may provide damping in a supply network associated with the RFIC. Furthermore, the decoupling conductor may have a self-resonance substantially close to an operating band associated with the RFIC to increase series isolation, introduce substrate losses that facilitate the damping in the supply network, and prevent high-Q resonances.