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公开(公告)号：US20160197617A1
公开(公告)日：2016-07-07
申请号：US14981264
申请日：2015-12-28
Applicant: QUALCOMM Incorporated
Inventor： Rick A. Wilcox , Daniel F. Filipovic , Xu Mike Chi , Chris M. Rosolowski
Abstract: An apparatus includes a temperature measuring device within a thermally conductive package. A crystal within the package is thermally coupled to the temperature measuring device and subjected to a same temperature as the temperature measuring device. A controller external to the package is configured to receive a signal from the crystal and a temperature measurement from the temperature measuring device. The controller is configured to estimate a frequency error of the crystal based on the temperature measurement and to provide a frequency error estimate to an external system.
Abstract translation: 一种装置包括在导热封装内的温度测量装置。 封装内的晶体热耦合到温度测量装置并经受与温度测量装置相同的温度。 封装外部的控制器被配置为从晶体接收信号和来自温度测量装置的温度测量。 控制器被配置为基于温度测量来估计晶体的频率误差，并且向外部系统提供频率误差估计。
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公开(公告)号：US10243569B2
公开(公告)日：2019-03-26
申请号：US14981264
申请日：2015-12-28
Applicant: QUALCOMM Incorporated
Inventor： Rick A. Wilcox , Daniel F. Filipovic , Xu Mike Chi , Chris M. Rosolowski
Abstract: An apparatus includes a temperature measuring device within a thermally conductive package. A crystal within the package is thermally coupled to the temperature measuring device and subjected to a same temperature as the temperature measuring device. A controller external to the package is configured to receive a signal from the crystal and a temperature measurement from the temperature measuring device. The controller is configured to estimate a frequency error of the crystal based on the temperature measurement and to provide a frequency error estimate to an external system.
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