公开(公告)号：US20250110174A1

公开(公告)日：2025-04-03

申请号：US18479598

申请日：2023-10-02

Applicant: QUALCOMM Incorporated

Inventor： Palkesh JAIN ,  Rahul GULATI ,  Niraj Shantilal PALIWAL ,  Nikhil Rajendra PATIL ,  Vipul Deepak AHUJA

IPC: G01R31/28 ,  H01L23/367

Abstract: Methods and apparatuses directed to detecting the degradation of electronic components based on thermal testing. In some examples, a device includes heat detection elements, a temperature controller, a memory, and a processor. The temperature controller can receive a signal from each of the heat detection elements and determine a corresponding operating temperature. The processor can receive the operating temperatures from the temperature controller, and can read from the memory a threshold temperature corresponding to each of the heat detection elements. Further, the processor can compare the operating temperatures to their corresponding threshold temperatures and, based on the comparison, generate thermal error data characterizing detected thermal discrepancies. The processor can transmit the thermal error data to cause further operations, such as the disabling of a safety feature, or the display of a warning message, for example.

公开(公告)号：US20230100036A1

公开(公告)日：2023-03-30

申请号：US17448864

申请日：2021-09-24

Applicant: QUALCOMM Incorporated

Inventor： Hee Jun PARK ,  Bohuslav RYCHLIK ,  Niraj Shantilal PALIWAL

IPC: G06F11/30 ,  G06F11/07 ,  G06F7/544 ,  G06N3/04

Abstract: Certain aspects of the present disclosure provide techniques for improved hardware utilization. An input data tensor is divided into a first plurality of sub-tensors, and a plurality of logical sub-arrays in a physical multiply-and-accumulate (MAC) array is identified. For each respective sub-tensor of the first plurality of sub-tensors, the respective sub-tensor is mapped to a respective logical sub-array of the plurality of logical sub-arrays, and the respective sub-tensor is processed using the respective logical sub-array.