公开(公告)号：US20170360316A1

公开(公告)日：2017-12-21

申请号：US15186347

申请日：2016-06-17

Applicant: QUALCOMM Incorporated

Inventor： Shiqun GU ,  Matthew Michael NOWAK ,  Kenneth KASKOUN ,  Eugene DANTSKER ,  Russel Allyn MARTIN

IPC: A61B5/024 ,  A61B5/1455 ,  A61B5/145 ,  A61B5/00

CPC classification number: A61B5/02433 ,  A61B5/14532 ,  A61B5/14551 ,  A61B5/14552 ,  A61B5/681 ,  A61B5/6823 ,  A61B5/6824 ,  A61B5/6828 ,  A61B5/7278 ,  A61B5/742 ,  A61B5/7475 ,  A61B2560/0214 ,  A61B2560/0475 ,  A61B2562/04 ,  A61B2562/046 ,  A61B2562/164

Abstract: Examples of monolithic integrated emitter-detector array in a flexible substrate for biometric sensing and associated devices and methods are disclosed. One disclosed example device includes a flexible substrate; a first array of emitters embedded in the flexible substrate, the first array of emitters configured to emit first electromagnetic (EM) signals; a first array of detectors embedded in the flexible substrate, the first array of detectors configured to detect reflections of the first EM signals; a first scanning circuit coupled to the first array of emitters, the first scanning circuit configured to selectively activate individual emitters of the first array of emitters; and a first sensing circuit coupled to individual detectors of the first array of detectors, the first sensing circuit configured to receive a detection signal from at least one of the detectors of the first array of detectors.

公开(公告)号：US20150150505A1

公开(公告)日：2015-06-04

申请号：US14094860

申请日：2013-12-03

Applicant: QUALCOMM Incorporated

Inventor： Kenneth KASKOUN ,  Brian David Niznik ,  Michael David Atella

IPC: A61B5/00

CPC classification number: A61B5/6833 ,  A61B5/0002 ,  A61B5/11 ,  A61B5/1112 ,  A61B5/684 ,  A61B5/7405 ,  A61B5/742 ,  A61B2560/0443

Abstract: An integrated adhesive sensor array includes an adhesive a patch, a sensor hub, and a detachable sensor pod packaged as a unit. The patch may include a docking area for the detachable sensor pod. The detachable sensor pod may include at least one sensor and may be configured to be detached from the patch and applied to various locations on a body. The detachable sensor pod may send sensor data to the sensor hub via a wired link when on the patch and via a wireless link when detached from the patch. The sensor hub receives sensor data from the detachable sensor pod and relays the data to a receiver. The sensor hub and detachable sensor pod may include indicators for communicating information. The sensor hub may include a power source for powering the sensor hub and a detachable sensor pod attached to the main sensor unit or patch.

Abstract translation: 集成的粘合剂传感器阵列包括粘合剂贴剂，传感器毂和作为一个单元包装的可拆卸的传感器盒。 补片可以包括用于可拆卸传感器盒的对接区域。 可拆卸的传感器盒可以包括至少一个传感器，并且可以被配置为从贴片上分离并施加到身体上的各个位置。 可拆卸的传感器盒可以在贴片上时通过有线链路将传感器数据发送到传感器集线器，并且当从贴片分离时通过无线链路发送传感器数据。 传感器集线器从可拆卸的传感器盒接收传感器数据，并将数据中继到接收器。 传感器集线器和可拆卸传感器盒可以包括用于传达信息的指示器。 传感器集线器可以包括用于为传感器集线器供电的电源和附接到主传感器单元或贴片的可拆卸传感器盒。

公开(公告)号：US20180228438A1

公开(公告)日：2018-08-16

申请号：US15950051

申请日：2018-04-10

Applicant: QUALCOMM Incorporated

Inventor： Kenneth KASKOUN ,  Brian David NIZNIK ,  Michael David ATELLA

IPC: A61B5/00 ,  A61B5/11

Abstract: An integrated adhesive sensor array includes an adhesive a patch, a sensor hub, and a detachable sensor pod packaged as a unit. The patch may include a docking area for the detachable sensor pod. The detachable sensor pod may include at least one sensor and may be configured to be detached from the patch and applied to various locations on a body. The detachable sensor pod may send sensor data to the sensor hub via a wired link when on the patch and via a wireless link when detached from the patch. The sensor hub receives sensor data from the various sensors, and relays the data to a receiver. The sensor hub and detachable sensor pod may include indicators for communicating information. The sensor hub may include a power source for powering the sensor hub and a detachable sensor pod attached to the main sensor unit or patch.

公开(公告)号：US20170119312A1

公开(公告)日：2017-05-04

申请号：US15404020

申请日：2017-01-11

Applicant: QUALCOMM Incorporated

Inventor： Kenneth KASKOUN ,  Brian David NIZNIK ,  Michael David ATELLA

IPC: A61B5/00

Abstract: An integrated adhesive sensor array includes an adhesive a patch, a sensor hub, and a detachable sensor pod packaged as a unit. The patch may include a docking area for the detachable sensor pod. The detachable sensor pod may include at least one sensor and may be configured to be detached from the patch and applied to various locations on a body. The detachable sensor pod may send sensor data to the sensor hub via a wired link when on the patch and via a wireless link when detached from the patch. The sensor hub receives sensor data from the detachable sensor pod and relays the data to a receiver. The sensor hub and detachable sensor pod may include indicators for communicating information. The sensor hub may include a power source for powering the sensor hub and a detachable sensor pod attached to the main sensor unit or patch.