公开(公告)号：US20210297226A1

公开(公告)日：2021-09-23

申请号：US17204644

申请日：2021-03-17

Applicant: QUALCOMM Incorporated

Inventor： Ahmed Attia Abotabl ,  Muhammad Sayed Khairy Abdelghaffar ,  Huillin Xu ,  Wanshi Chen ,  Krishna Kiran Mukkavilli ,  Tingfang Ji ,  Shimman Arvind Patel

IPC: H04L5/14 ,  H04W72/04

Abstract: Full-duplex communication techniques are described. Some aspects may utilize full-duplex-slot formats, such as may be provided in addition to or in the alternative to uplink, downlink, and flexible slot formats. A full-duplex slot implemented in accordance with a full-duplex-slot format provides a slot in which the frequency band may be used for both uplink and downlink transmissions. Downlink and/or uplink transmissions of a full-duplex slot may occur in overlapping frequency bands or in adjacent frequency bands. A first wireless device may transmit slot signaling comprising one or more full-duplex-slot-indicator parameters. A second wireless device may base one or more full-duplex slot configuration determinations on a full-duplex-slot configuration. The second wireless device may apply one or more full-duplex-slot-indicator-parameter rules with respect to full-duplex-slot-indicator parameters for determining a full-duplex-slot format. Other aspects and features are also claimed and described.