公开(公告)号：US20250062203A1

公开(公告)日：2025-02-20

申请号：US18451354

申请日：2023-08-17

Applicant: QUALCOMM Incorporated

Inventor： Hi Moon ,  Joan Rey Villarba Buot ,  Aniket Patil

IPC: H01L23/498 ,  H01L21/48 ,  H01L23/14 ,  H01L23/15

Abstract: A substrate includes a core layer and one or more metallization layers. The core layer provides stabilization to the substrate to reduce or avoid warpage. The core layer may include a glass material weaved throughout the core to provide stabilization and avoid warpage. A metallization layer adjacent to the core layer in the substate includes an insulation layer and the embedded metal structure(s) that is positioned from the core layer. The thickness of the insulation layer is greater than the embedded metal structure so that a surface of the embedded metal structure is positioned at least at a length from the surface of the glass material. This can avoid or reduce the risk of the embedded metal structure electrically shorting to another metal structure in the substrate through the core layer.