公开(公告)号：US12229883B2

公开(公告)日：2025-02-18

申请号：US18177028

申请日：2023-03-01

Applicant: QUALCOMM Incorporated

Inventor： Minghua Liu ,  Yinhao Zhu ,  Hong Cai ,  Fatih Murat Porikli ,  Hao Su

IPC: G06T17/00 ,  G06T7/12 ,  G06V10/25 ,  G06V20/70

Abstract: Systems and techniques are provided for part segmentation. For example, a process for performing part segmentation can include obtaining a three-dimensional capture of an object. The method can include generating one or more two-dimensional images of the object from the three-dimensional capture of the object. The method can further include processing the one or more two-dimensional images of the object to generate at least one two-dimensional bounding box associated with a part of the object. The method can include performing three-dimensional part segmentation of the part of the object based on a three-dimensional point cloud generated from the one or more two-dimensional images of the object and the at least one two-dimensional bounding box and based on semantically labeled super points which are merged into subgroups associated with the part of the object.