公开(公告)号：US11514658B2

公开(公告)日：2022-11-29

申请号：US17153773

申请日：2021-01-20

Applicant: QUALCOMM Incorporated

Inventor： Ashar Ali ,  Gokee Dane ,  Gerhard Reitmayr

IPC: G06T17/20 ,  G06T19/20 ,  G06T15/20

Abstract: Systems and techniques are provided for modeling three-dimensional (3D) meshes using multi-view image data. An example method can include determining, based on a first image of a target, first 3D mesh parameters for the target corresponding to a first coordinate frame; determining, based on a second image of the target, second 3D mesh parameters for the target corresponding to a second coordinate frame; determining third 3D mesh parameters for the target in a third coordinate frame, the third 3D mesh parameters being based on the first and second 3D mesh parameters and relative rotation and translation parameters of image sensors that captured the first and second images; determining a loss associated with the third 3D mesh parameters, the loss being based on the first and second 3D mesh parameters and the relative rotation and translation parameters; determining 3D mesh parameters based on the loss and third 3D mesh parameters.